"Moisture Cut", a high-barrier sealant for organic devices

Tuesday, 03 September 2013

"Moisture Cut", a high-barrier sealant for organic devices, featuring low moisture permeability and extended device life, is released.

20130705 01 01

 

This high-barrier sealant for organic devices was developed to solve problems in the market for state-of-the-art organic devices. It achieves extremely low moisture permeability by controlling moisture permeation through improved resin content functionality by adopting a functional polymer, a special high-density filler, and improved adhesion at the substrate interface. Practical evaluation shows excellent sealing properties, such that it is attracting attention as a product for extending device life. We believe that such an epoch-making product will develop new business.